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1. general description the tea1611t is a monolithic integrated circuit implemented in a high voltage diffusion metal oxide semiconductor (dmos) process, which is a high voltage controller for a zero voltage switching resonant converter. the ic provides the drive function for two discrete power mosfets in a half-bridge con?guration. it also includes a level-shift circuit, an oscillator with accurately programmable frequency range, a latched shut-down function and a transconductance error ampli?er. to guarantee an accurate 50 % switching duty factor, the oscillator signal passes through a divide-by-two ?ip-?op before being fed to the output drivers. the circuit is very ?exible and enables a broad range of applications for different mains voltages. 2. features n integrated high voltage level-shift function n integrated high voltage bootstrap diode n low start-up current (green function) n adjustable non-overlap time n internal overtemperature protection (otp) n overcurrent protection (ocp) that activates a shut-down timer tea1611t zero voltage switching resonant converter controller rev. 01 7 september 2009 product data sheet fig 1. basic con?guration half- bridge circuit resonant converter tea1611 v hs vaux mosfet switch bridge voltage supply (high side) signal ground power ground 014aaa681
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 2 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller n soft start timing pin n transconductance error ampli?er for ultra high-ohmic regulation feedback n latched shut-down circuit for overvoltage protection (ovp) n adjustable minimum and maximum frequencies n undervoltage lockout (uvlo) n fault latch reset input n wide (max 20 v) supply voltage range 3. applications n tv and monitor power supplies n high voltage power supplies 4. ordering information table 1. ordering information type number package name description version tea1611t so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 3 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller 5. block diagram fig 2. block diagram 014aaa680 tea1611 p vco css pgnd sh gh 2.5 v 5 m a vdd(float) sgnd reset gl vaux v dd ifs cf irs ocp sd ct vref 3 v 0.6 v 16 13 v bootstrap supply logic oscillator timer level shifter high side driver g m reset shut-down start-up reset i ch i dch low side driver start/stop oscillation 2 : 2 2.5 v 2.33 v 0.3 v buffer over temperature protection
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 4 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller 6. pinning information 6.1 pinning 6.2 pin description [1] provided as a high voltage spacer fig 3. pin con?guration tea1611 p vref vco sd css irs ct cf ocp ifs pgnd reset n.c. vaux sh v dd gh gl vdd(float) sgnd 014aaa684 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 table 2. pin description symbol pin description p 1 error ampli?er non-inverting input vco 2 error ampli?er output css 3 soft start capacitor input ct 4 timer capacitor input ocp 5 overcurrent protection input pgnd 6 power ground n.c. 7 not connected [1] sh 8 high side switch source connection gh 9 high side switch gate connection vdd(float) 10 ?oating supply high side driver sgnd 11 signal ground gl 12 low side switch gate connection v dd 13 supply voltage vaux 14 auxiliary supply voltage reset 15 latch reset input ifs 16 oscillator discharge current input cf 17 oscillator capacitor irs 18 oscillator charge input current sd 19 shut-down input vref 20 reference voltage
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 5 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller 7. functional description 7.1 start-up when the applied voltage at v dd reaches v dd(init) (see figure 4 ), the low side power switch is turned on while the high side power switch remains in the non-conducting state. this start-up output state guarantees the initial charging of the bootstrap capacitor (c boot ) used for the ?oating supply of the high side driver. during start-up, the voltage on the frequency capacitor pin (cf) is zero and de?nes the start-up state. the voltage at the soft start pin (css) is set to 2.5 v. the css pin voltage is copied to the vco pin via a buffer and switching starts at about 80 % of the maximum frequency at the moment v dd reaches the start level. the start-up state is maintained until v dd reaches the start level (13.5 v), the oscillator is activated and the converter starts operating. 7.2 oscillator the internal oscillator is a current-controlled sawtooth oscillator. the frequency of the sawtooth is determined by the external capacitor c f and the currents ?owing into the ifs and irs pins. the minimum frequency and the non-overlap time are set by the capacitor c f and the resistors r f(min) and r no . the maximum frequency is set by resistor r d f (see figure 7 ). the oscillator frequency is exactly twice the bridge frequency to achieve an accurate 50 % duty factor. an overview of the oscillator and driver signals is given in figure 5 . fig 4. start-up 014aaa036 v dd 0 0 0 gh-sh v dd(startup) v dd(init) t gl
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 6 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller 7.3 non-overlap time resistor the non-overlap time resistor r no is connected between the 3 v reference pin (vref) and the ifs current input pin (see figure 7 ). the voltage on the ifs pin is kept at a temperature-independent value of 0.6 v. the current that ?ows into the ifs pin is determined by the value of resistors r no 2.4 v voltage drop divided by its value. the ifs input current equals 1/16 of the discharge current of capacitor c f and determines the falling slope of the oscillator. the falling slope time is used to create a non-overlap time (t no ) between two successive switching actions of the half-bridge switches: 7.4 minimum frequency resistor the r f(min) resistor is connected between the vref pin (3 v reference voltage) and the irs current input (kept at a temperature-independent voltage level of 0.6 v). the charge current of the capacitor c f is twice the current ?owing into the irs pin. the r f(min) resistor has a voltage drop of 2.4 v and its resistance de?nes the minimum charge current (rising slope) of the c f capacitor if the control current is zero. the minimum frequency is de?ned by this minimum charge current (i irs1 ) and the discharge current: fig 5. oscillator and driver signals 014aaa685 t non-overlap time (high to low) non-overlap time (low to high) cf gl 0 0 gh-sh i ifs 2.4v r no ----------- = t no c f d v cf 16 i ifs -------------------------- = i irs1 2.4v r fmin () ----------------- = t irs1 c f d v cf 2i irs1 -------------------------- =
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 7 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller 7.5 maximum frequency resistor the output voltage is regulated by changing the frequency of the half-bridge converter. the maximum frequency is determined by the r d f resistor which is connected between the error ampli?er output vco and the oscillator current input pin irs. the current that ?ows through the r d f resistor (i irs2 ) is added to the current ?owing through the r f(min) resistor. as a result, the charge current icf increases and the oscillation frequency increases. as the falling slope of the oscillator is constant, the relationship between the output frequency and the charge current is not a linear function (see figure 6 and figure 7 ): the maximum output voltage of the error ampli?er and the value of r d f determine the maximum frequency: the frequency of the oscillator depends on the value of capacitor c f , the peak-to-peak voltage swing v cf and the charge and discharge currents. the accuracy of the oscillator frequency decreases at higher frequencies due to delays in the circuit. f osc min ) () 1 t no t irs1 ------------------------ - = f bridge min () f osc min () 2 --------------------- = i irs2 v vco 0.6 C r d f --------------------------- = t irs2 c f d v cf 2i irs1 i irs2 + () -------------------------------------------- - = i irs2 max () v vco max () 0.6 C r d f --------------------------------------- = t irs min () c f d v cf 2i irs2 i irs2 max () + () --------------------------------------------------------- = f osc max () 1 t osc ------------ - = f bridge max () f osc max () 2 ---------------------- = t osc t irs min () t no + =
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 8 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller 7.6 error ampli?er the error ampli?er is a transconductance ampli?er. the output current at pin vco is determined by the ampli?er transconductance, the differential voltage between input pin p, and the internal 2.5 v reference voltage. the output current i vco is fed to the irs input of the current-controlled oscillator. the source capability of the error ampli?er increases current in the irs pin with a positive differential input voltage. therefore the minimum current is determined by resistor r f(min) and the minimum frequency setting is independent of the characteristics of the error ampli?er. the error ampli?er has a maximum output current of 0.5 ma for an output voltage of up to 2.5 v. if the source current decreases, the oscillator frequency also decreases resulting in a higher regulated output voltage. during start-up, the output voltage of the ampli?er is connected to the soft start (css) pin via a buffer. this will hold the vco pin at a constant value of 2.5 v. 7.7 soft start the css pin voltage is copied to the vco pin via a buffer. this buffer only has a source capability, i.e. it can only charge the vco pin. this means that the error ampli?er output can increase the vco pin voltage above the css voltage level. at start-up the soft start capacitor is charged to 2.5 v setting a start-up frequency of about 80 % of the maximum frequency. after start-up the external soft start capacitor is discharged by i start(soft) . the vco pin voltage will follow the css voltage (discharging takes place via r d f ) and the frequency sweeps down. the css capacitor will determine the frequency sweep rate. when the circuit comes into regulation, the error ampli?er output will control the vco pin voltage and the css voltage will sweep down further to zero volt. fig 6. frequency range 014aaa038 0 f osc(max) f osc(start) f osc f osc(min) i irs
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 9 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller 7.8 overcurrent protection and timer the ocp input continuously compares the ocp pin voltage with vref. when the ocp pin voltage is higher than vref, the timer capacitor ct will be charged with i ch during the next full cf cycle. else the timer capacitor will be discharged with i leak . in case the ct voltage exceeds v trip(h) , the tea1611t will switch over to shut-down mode. the timer capacitor will be discharged with i dch until the ct voltage reaches v trip(l) after which a soft start cycle is started. 7.9 shut-down the shut-down input (sd) has an accurate threshold level of 2.33 v. when the voltage on input sd reaches 2.33 v, the tea1611t enters shut-down mode. during shut-down mode, pin v dd is clamped by an internal 12 v zener diode with a 1 ma input current. this clamp prevents v dd rising above the rating of 14 v due to low supply current to the tea1611t in shut-down mode. when the tea1611t is in the shut-down mode, it can be activated again only by lowering v dd below the v dd(rst) level (typically 5.3 v) or by making the reset input active. the shut-down latch is then reset and a new start-up cycle can begin. in shut-down mode the gl pin is high and the gh pin is low. in this way the bootstrap capacitor remains charged, allowing a new, well de?ned cycle to start after a reset. 7.10 overtemperature protection (otp) the tea1611t continuously monitors its temperature. when the temperature exceeds the t otp(act) level, the tea1611t will switch to shut-down mode. 7.11 latch reset input the internal shut-down latch can be reset via the reset input. this input is active low. 7.12 vaux input when the ic is oscillating the start-up resistor is not able to deliver the supply current so that an auxiliary supply (for instance via an auxiliary winding or a dv/dt supply) is needed. the vaux input facilitates a series regulator which regulates its output voltage (= v dd voltage) to v dd(reg) . 8. limiting values table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit supply voltages v drv(hs) high-side driver voltage 0 600 v v dd supply voltage [1] 014v v cc(aux) auxiliary supply voltage [1] 020v
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 10 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller [1] it is recommended that a buffer capacitor is placed as close as possible to the vdd pin (as indicated in figure 7 and in the application note). [2] human body model class 2: equivalent to discharging a 100 pf capacitor through a 1.5 k w series resistor. [3] machine model class 2: equivalent to discharging a 200 pf capacitor through a 0.75 mh coil and 10 w resistor. 9. thermal characteristics 10. characteristics voltage on pins p, sd, reset and ocp v i input voltage 0 5 v currents i ifs current on pin ifs - 1/16 ma i irs current on pin irs - 1 ma i vref current on pin vref - - 2ma power and temperature p tot total power dissipation t amb < 70 c - 0.8 w t amb ambient temperature operating - 25 +70 c t stg storage temperature - 25 +150 c handling v esd electrostatic discharge voltage human body model [2] - 2000 v machine model [3] - 200 v table 3. limiting values continued in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit table 4. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air 100 k/w table 5. characteristics all voltages are referred to the ground pins which must be connected externally; positive currents ?ow into the ic; v dd =13v and t amb = 25 ?c; tested using the circuit shown in figure 7 , unless otherwise speci?ed. symbol parameter conditions min typ max unit high voltage pins vdd(float), gh and sh i leak leakage current v dd(f) , v gh and v sh = 600 v --30 m a supply pins v dd , vaux v dd(init) initial supply voltage de?ned driver output; low side on; high side off - 45v v dd(startup) start-up supply voltage 12.9 13.4 13.9 v v dd(stop) stop supply voltage 9.0 9.4 9.8 v v dd(hys) hysteresis of supply voltage 3.8 4.0 4.2 v
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 11 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller v dd(reg) regulation supply voltage vaux = 17 v - 12.6 - v v dd supply voltage current capability series regulator; v cc(aux) =17v; i dd =50ma -12-v clamp voltage in shut-down state; low side on; high side off; i dd =1ma 11.0 12.0 13.0 v v rst reset voltage 4.5 5.3 6.0 v i dd supply current [1] start-up 210 260 310 m a operating - 2.4 - ma shut-down - 220 270 m a reference voltage on pin vref v ref reference voltage i ref = 0 ma 2.9 3.0 3.1 v i ref reference current source only - 2.0 - - ma z o output impedance i ref = - 1 ma - 5.0 - w tc temperature coef?cient i ref = 0 ma; t j =25 c to 150 c - - 0.3 - mv/k current controlled oscillator pins irs, ifs, cf i ch(cf)min minimum charge current on pin cf i irs =15 m a; v cf =2v 28 30 32 m a i ch(cf)max maximum charge current on pin cf i irs = 200 m a; v cf = 2 v 340 380 420 m a v irs voltage on pin irs i irs = 200 m a 590 620 650 mv i dch(cf)min minimum discharge current on pin cf i ifs = 50/16 m a; v cf =2v 47 50 53 m a i dch(cf)max maximum discharge current on pin cf i ifs = 1/16 m a; v cf = 2 v 0.89 0.94 0.99 ma v ifs voltage on pin ifs i ifs = 1/16 ma 570 600 630 mv f bridge(min) minimum bridge frequency c f = 100 pf; i ifs = 0.5/16 ma; i irs =50 m a; f bridge = 156 167 178 khz f bridge(max) maximum bridge frequency c f = 100 pf; i ifs = 1/16 ma; i irs = 200 m a; f bridge = [2] 395 440 485 khz v trip(l) low-level trip voltage pin cf; dc level - 1.27 - v v trip(h) high-level trip voltage pin cf; dc level - 2.97 - v table 5. characteristics continued all voltages are referred to the ground pins which must be connected externally; positive currents ?ow into the ic; v dd =13v and t amb = 25 ?c; tested using the circuit shown in figure 7 , unless otherwise speci?ed. symbol parameter conditions min typ max unit f osc 2 ------------ - f osc 2 ------------ -
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 12 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller v cf(p-p) peak-to-peak voltage on pin cf dc level 1.6 1.7 1.8 v t no non-overlap time c f = 100 pf; i ifs = 0.5/16 ma; i irs =50 m a 0.58 0.63 0.68 m s i dch(osc) /i ifs oscillator discharge current to current on pin ifs ratio i ifs = 0.5/16 ma; 14.4 16 17.6 output drivers i source(gh) source current on pin gh high side; v dd(f) = 11.2 v; v sh =0v; v gh =0v - 300 - ma i sink(gh) sink current on pin gh high side; v dd(f) = 11.2 v; v sh =0v; v gh = 11.2 v - 480 - ma i source(gl) source current on pin gl low side; v gl = 0 v - 300 - ma i sink(gl) sink current on pin gl low side; v gl =13v - 580 - ma v oh high-level output voltage pin gh; high side; v dd(f) = 11.2 v; v sh =0v; i gh =10ma - 10.9 - v pin gl; low side; i gl =10ma - 12.6 - v v ol low-level output voltage pin gl; high side; v dd(f) = 11.2 v; v sh =0v; i gh =10ma - 0.17 - v pin gl; low side; i gl =10ma - 0.18 - v v fd(bs) bootstrap diode forward voltage i o = 5 ma 1.3 1.6 1.9 v shut-down input pin sd i i input current v sd = 2.33 v - - 0.5 m a v th(sd) threshold voltage on pin sd 2.26 2.33 2.40 v error ampli?er pins p, vco i i(cm) common-mode input current v i(cm) =1v - - 0.1 - 0.5 m a v i(cm) common-mode input voltage - - 2.5 v v i(offset) offset input voltage v i(cm) =1v; i vco = - 10 ma - 2 0 +2 mv g m transconductance v i(cm) = 1 v; source only - 330 - m a/mv g ol open-loop gain r l =10k w to gnd; v i(cm) =1v -70-db gb gain bandwidth product r l =10k w to gnd; v i(cm) =1v - 5 - mhz v vco(max) maximum vco voltage operating; r l =10k w to gnd 3.2 3.6 4.0 v i vco(max) maximum vco current operating; v vco =1v - 0.4 - 0.5 - 0.6 ma v o output voltage during start-up; i vco = 0.3 ma 2.5 2.7 2.9 v table 5. characteristics continued all voltages are referred to the ground pins which must be connected externally; positive currents ?ow into the ic; v dd =13v and t amb = 25 ?c; tested using the circuit shown in figure 7 , unless otherwise speci?ed. symbol parameter conditions min typ max unit
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 13 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller [1] the supply current i dd increases with an increasing bridge frequency to drive the capacitive load of two mosfets. typical mosfets for the tea1611t application are 8n50 (nxp type phx80n50e, q g(tot) = 55 nc typ.) and these will increase the supply current at 150 khz according to the following formula: low side on; high side off; c f = 100 pf; i ifs = 0.5 ma; i irs =50 m a; low side off; high side off; v dd =9v [2] the frequency of the oscillator depends on the value of capacitor c f , the peak-to-peak voltage swing v cf and the charge/discharge currents i cf(ch) and i cf(dis) . reset pin v rst reset voltage 2.15 2.4 2.65 v v rst(hys) hysteresis of reset voltage - 0.65 - v i i(rst) reset input current - - 1 m a css pin i start(soft) soft start current 12 15 18 m a ct pin i ch charge current 21 27 33 m a i dch discharge current 8 10 12 m a i leak leakage current 0.1 0.3 1 m a i ch /i dch charge current to discharge current ratio 2.4 2.7 3.0 m a v trip(h) high-level trip voltage 2.7 3 3.3 v v trip(l) low-level trip voltage 0.6 0.7 0.8 v ocp pin v ref reference voltage 280 305 330 mv otp t otp(act) activation overtemperature protection temperature 120 135 150 c table 5. characteristics continued all voltages are referred to the ground pins which must be connected externally; positive currents ?ow into the ic; v dd =13v and t amb = 25 ?c; tested using the circuit shown in figure 7 , unless otherwise speci?ed. symbol parameter conditions min typ max unit d i dd 2q gtot () f bridge 2 55nc 150khz 16.5ma ===
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 14 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller 11. application information (1) construction 1: regulation feedback connected to pin 1. (2) construction 2: regulation feedback connected to pin 19 with resistor. fig 7. application diagram 014aaa683 tea1611 1 15 2 10 9 8 12 6 19 5 20 18 17 16 13 14 11 p vco pgnd sh gh c boot l p l r(ext) c p sgnd bridge voltage supply (high side) regulator feedback latch reset reset gl c vdd ifs cf irs r d f r f(min) ocp sd output voltage v ref 3 v 0.3 v supply logic oscillator level shifter high side driver timer low side driver g m c r + - r no v dd vaux 18 v 12.6 v on/off vdd(float) : 2 c f overvoltage protection c t 2.33 v (1) (2) 600 mv 600 mv 3 css c ss 2.7 v 2.5 v start-up
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 15 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller 12. package outline fig 8. package outline sot163-1 (so20) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec jeita mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 sot163-1 10 20 w m b p detail x z e 11 1 d y 0.25 075e04 ms-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a so20: plastic small outline package; 20 leads; body width 7.5 mm sot163-1 99-12-27 03-02-19
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 16 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller 13. revision history table 6. revision history document id release date data sheet status change notice supersedes tea1611t_1 20090907 product data sheet - -
tea1611t_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 7 september 2009 17 of 18 nxp semiconductors tea1611t zero voltage switching resonant converter controller 14. legal information 14.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 14.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 14.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. quick reference data the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. 14.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 15. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors tea1611t zero voltage switching resonant converter controller ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 7 september 2009 document identifier: tea1611t_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 16. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 start-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.3 non-overlap time resistor . . . . . . . . . . . . . . . . . 6 7.4 minimum frequency resistor . . . . . . . . . . . . . . . 6 7.5 maximum frequency resistor. . . . . . . . . . . . . . . 7 7.6 error ampli?er . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.7 soft start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.8 overcurrent protection and timer . . . . . . . . . . . 9 7.9 shut-down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.10 overtemperature protection (otp) . . . . . . . . . 9 7.11 latch reset input . . . . . . . . . . . . . . . . . . . . . . . . 9 7.12 vaux input . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 thermal characteristics. . . . . . . . . . . . . . . . . . 10 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10 11 application information. . . . . . . . . . . . . . . . . . 14 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 13 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 14 legal information. . . . . . . . . . . . . . . . . . . . . . . 17 14.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 14.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 14.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 14.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 15 contact information. . . . . . . . . . . . . . . . . . . . . 17 16 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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